This is component preparation, not a recovery outcome
A successful-looking reball does not demonstrate readable data. The video documents physical handwork only and deliberately makes no claim about a donor board, controller compatibility or extraction result.
Damaged coating changes the preparation stage
When the original surface and fine connections have been disturbed, cleaning alone may be insufficient. The damaged area must be stabilized and prepared before a new ball pattern can be formed.
UV curing protects the reconstructed surface
The green protective material is applied and cured before reballing. Its role is physical isolation and protection around the prepared connections, not data repair by itself.
Reballing is one stage in a longer process
A rebuilt solder-ball pattern prepares the package for a later installation or controlled recovery workflow. Device identity, encryption, controller condition and the rest of the board still determine what is possible.
